Wire bonding in microelectronics : materials, processes, reliability and yield
Harman, George G.
Wire bonding in microelectronics : materials, processes, reliability and yield - 2nd ed. - New York, N.Y. : McGraw-Hill, 1997 - 290
WIRE BONDING (ELECTRONIC PACKAGING)--PRODUCTION CONTROL
ELECTRONIC PACKAGING--RELIABILITY
ELECTRONIC PACKAGING--DEFECTS
SEMICONDUCTORS--FAILURE
TK7836 / H375W 1997
Wire bonding in microelectronics : materials, processes, reliability and yield - 2nd ed. - New York, N.Y. : McGraw-Hill, 1997 - 290
WIRE BONDING (ELECTRONIC PACKAGING)--PRODUCTION CONTROL
ELECTRONIC PACKAGING--RELIABILITY
ELECTRONIC PACKAGING--DEFECTS
SEMICONDUCTORS--FAILURE
TK7836 / H375W 1997
