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Electronic assembly fabrication : chips, circuit boards, packages, and components / Charles A. Harper editor-in-chief

Contributor(s): Material type: TextTextSeries: McGraw-Hill professional engineering | Electronic packaging and interconnection seriesPublication details: New York, N.Y. : McGraw-Hill, c2002Description: 672 pISBN:
  • 0071378820
Subject(s): LOC classification:
  • TK7870 E432
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Item type Home library Collection Shelving location Call number Status Barcode
Books Books BU Library and Learning Space Books Book Shelves TK7870 E432 (Browse shelf(Opens below)) Available 200207020041
Total holds: 0

Includes index

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