Lau, John H. <br/><br/>
Microvias :  for low cost, high density interconnects / 
John H. Lau, S.W. Ricky Lee 
 - New York, N.Y. :  McGraw-Hill,  c2001 
 - 565 p. :  ill. 
 - McGraw-Hill professional engineering .
<br/><br/>Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>0071363270 
<br/><br/><label>Subjects--Topical Terms: </label><br/>MICROELECTRONIC PACKAGING<br/>INTEGRATED CIRCUITS--DESIGN AND CONSTRUCTION--COST CONTROL<br/>SEMICONDUCTORS--JUNCTIONS<br/>PRINTED CIRCUITS
<br/><br/><label>LC Class. No.: </label>TK7874  / L38M