Microvias : for low cost, high density interconnects / John H. Lau, S.W. Ricky Lee
Material type:
- 0071363270
- TK7874 L38M
Item type | Home library | Collection | Shelving location | Call number | Status | Barcode | |
---|---|---|---|---|---|---|---|
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BU Library and Learning Space | Books | Book Shelves | TK7874 L38M (Browse shelf(Opens below)) | Available | 200404160031 |
Includes bibliographical references and index
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