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Wire bonding in microelectronics : materials, processes, reliability and yield

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Material type: Text

TextPublication details: New York, N.Y. : McGraw-Hill, 1997Edition: 2nd edDescription: 290Subject(s):

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Holdings
Item type	Home library	Collection	Shelving location	Call number	Status	Barcode
Books	BU Library and Learning Space	Books	Book Shelves	TK7836 H375W 1997 (Browse shelf(Opens below))	Available	215786

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